{"product_id":"3d-ic-integration-and-packaging-9780071848060","title":"3D IC Integration and Packaging","description":"\u003cp\u003e • Author(s): John H. Lau\u003cbr\u003e • Publisher: McGraw-Hill Companies\u003cbr\u003e • Publisher Imprint: McGraw-Hill Companies\u003cbr\u003e • BISAC: Electricity\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product\u003c\/b\u003e.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003eA comprehensive guide to 3D IC integration and packaging technology\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging\u003c\/i\u003e fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging \u003c\/i\u003ecovers: \u003cbr\u003e\u003cbr\u003e\u003cbr\u003e- 3D integration for semiconductor IC packaging\u003cbr\u003e- Through-silicon vias modeling and testing\u003cbr\u003e- Stress sensors for thin-wafer handling and strength measurement\u003cbr\u003e- Package substrate technologies\u003cbr\u003e- Microbump fabrication, assembly, and reliability\u003cbr\u003e- 3D Si integration\u003cbr\u003e- 2.5D\/3D IC integration\u003cbr\u003e- 3D IC integration with passive interposer\u003cbr\u003e- Thermal management of 2.5D\/3D IC integration\u003cbr\u003e- Embedded 3D hybrid integration\u003cbr\u003e- 3D LED and IC integration\u003cbr\u003e- 3D MEMS and IC integration\u003cbr\u003e- 3D CMOS image sensors and IC integration\u003cbr\u003e- PoP, chip-to-chip interconnects, and embedded fan-out WLP\u003cbr\u003e","brand":"Atlantic Books","offers":[{"title":"Hardcover","offer_id":46506487251095,"sku":"9780071848060","price":23489.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780071848060.webp?v=1769196504","url":"https:\/\/atlanticbooks.com\/products\/3d-ic-integration-and-packaging-9780071848060","provider":"Atlantic Books","version":"1.0","type":"link"}