{"product_id":"advanced-metallization-conference-2002-amc-2002-volume-18-9781558997196","title":"Advanced Metallization Conference 2002 (AMC 2002): Volume 18","description":"\u003cp\u003e • Author(s): Bradley M. Melnick | Timothy S. Cale | Shigeaki Zaima\u003cbr\u003e • Publisher: Materials Research Society\u003cbr\u003e • Publisher Imprint: Materials Research Society\u003cbr\u003e • BISAC: Materials Science - General\u003c\/p\u003e\u003cp\u003eLeading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k\/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Hardcover","offer_id":47813615321239,"sku":"9781558997196","price":3134.0,"currency_code":"INR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9781558997196.webp?v=1778337191","url":"https:\/\/atlanticbooks.com\/products\/advanced-metallization-conference-2002-amc-2002-volume-18-9781558997196","provider":"Atlantic Books","version":"1.0","type":"link"}