{"product_id":"assembly-and-reliability-of-lead-free-solder-joints-9789811539220","title":"Assembly and Reliability of Lead-Free Solder Joints","description":"\u003cp\u003e • Author(s): John H. Lau\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - Circuits - General\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.\u003cbr\u003e\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45275917353111,"sku":"9789811539220","price":8447.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9789811539220.webp?v=1769284232","url":"https:\/\/atlanticbooks.com\/products\/assembly-and-reliability-of-lead-free-solder-joints-9789811539220","provider":"Atlantic Books","version":"1.0","type":"link"}