{"product_id":"design-for-test-and-test-optimization-techniques-for-tsv-based-3d-stacked-ics-9783319345345","title":"Design-For-Test and Test Optimization Techniques for Tsv-Based 3D Stacked ICS","description":"\u003cp\u003e • Author(s): Brandon Noia\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Computer Architecture\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003eThis book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable. \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e- Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;\u003cbr\u003e- Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;\u003cbr\u003e- Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective. \u003cp\u003e\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45273702793367,"sku":"9783319345345","price":7470.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9783319345345.webp?v=1769237331","url":"https:\/\/atlanticbooks.com\/products\/design-for-test-and-test-optimization-techniques-for-tsv-based-3d-stacked-ics-9783319345345","provider":"Atlantic Books","version":"1.0","type":"link"}