{"product_id":"electromigration-in-thin-films-and-electronic-devices-materials-and-reliability-9780081016961","title":"Electromigration in Thin Films and Electronic Devices: Materials and Reliability","description":"\u003cp\u003e • Author(s): Choong-Un Kim | C-U Kim | Choong-Un Kim\u003cbr\u003e • Publisher: Woodhead Publishing\u003cbr\u003e • Publisher Imprint: Woodhead Publishing\u003cbr\u003e • BISAC: Materials Science - General\u003c\/p\u003e\u003cp\u003eUnderstanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. \"Electromigration in Thin Films and Electronic Devices\" provides an up-to-date review of key topics in this commercially important area.\u003c\/p\u003e","brand":"Woodhead Publishing","offers":[{"title":"Paperback","offer_id":46866986500247,"sku":"9780081016961","price":25204.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780081016961.webp?v=1769984090","url":"https:\/\/atlanticbooks.com\/products\/electromigration-in-thin-films-and-electronic-devices-materials-and-reliability-9780081016961","provider":"Atlantic Books","version":"1.0","type":"link"}