{"product_id":"guidebook-for-managing-silicon-chip-reliability-9780849396243","title":"Guidebook for Managing Silicon Chip Reliability","description":"\u003cp\u003e • Author(s): Michael Pecht | Riko Radojcic | Gopal Rao\u003cbr\u003e • Publisher: CRC Press\u003cbr\u003e • Publisher Imprint: CRC Press\u003cbr\u003e • BISAC: Electricity\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eAchieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003eThis quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? \u003cp\u003e\u003c\/p\u003eChapters discuss: \u003cli\u003efailure sites, operational loads, and failure mechanism\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eintrinsic device sensitivities\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eelectromigration\u003cbr\u003e \u003c\/li\u003e\u003cli\u003ehot carrier aging\u003cbr\u003e \u003c\/li\u003e\u003cli\u003etime dependent dielectric breakdown\u003cbr\u003e \u003c\/li\u003e\u003cli\u003emechanical stress induced migration\u003cbr\u003e \u003c\/li\u003e\u003cli\u003ealpha particle sensitivity\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eelectrostatic discharge (ESD) and electrical overstress\u003cbr\u003e \u003c\/li\u003e\u003cli\u003elatch-up\u003cbr\u003e \u003c\/li\u003e\u003cli\u003equalification\u003cbr\u003e \u003c\/li\u003e\u003cli\u003escreening\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eguidelines for designing reliability \u003cp\u003e\u003c\/p\u003eGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.\u003c\/li\u003e","brand":"CRC Press","offers":[{"title":"Hardcover","offer_id":46897039442071,"sku":"9780849396243","price":15336.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780849396243.webp?v=1770360872","url":"https:\/\/atlanticbooks.com\/products\/guidebook-for-managing-silicon-chip-reliability-9780849396243","provider":"Atlantic Books","version":"1.0","type":"link"}