{"product_id":"hybrid-bonding-advanced-substrates-failure-mechanisms-and-thermal-management-for-chiplets-and-heterogeneous-integration-9789819641659","title":"Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration","description":"\u003cp\u003e • Author(s): John Lau | Xuejun Fan\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - Semiconductors\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Hardcover","offer_id":47657925476503,"sku":"9789819641659","price":13221.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9789819641659.webp?v=1775815654","url":"https:\/\/atlanticbooks.com\/products\/hybrid-bonding-advanced-substrates-failure-mechanisms-and-thermal-management-for-chiplets-and-heterogeneous-integration-9789819641659","provider":"Atlantic Books","version":"1.0","type":"link"}