{"product_id":"integrated-circuit-hybrid-and-multichip-module-package-design-guidelines-a-focus-on-reliability-9780471594468","title":"Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability","description":"\u003cp\u003e • Author(s): Michael Pecht\u003cbr\u003e • Publisher: Wiley-Interscience\u003cbr\u003e • Publisher Imprint: Wiley-Interscience\u003cbr\u003e • BISAC: Electronics - General\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eCircuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.\u003c\/p\u003e \u003cp\u003eIts uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:\u003c\/p\u003e  *Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost *Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data *Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures *Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved *Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins  \u003cp\u003eDetailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.\u003c\/p\u003e","brand":"Wiley-Interscience","offers":[{"title":"Hardcover","offer_id":45203776077975,"sku":"9780471594468","price":18343.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780471594468.webp?v=1767308267","url":"https:\/\/atlanticbooks.com\/products\/integrated-circuit-hybrid-and-multichip-module-package-design-guidelines-a-focus-on-reliability-9780471594468","provider":"Atlantic Books","version":"1.0","type":"link"}