{"product_id":"materials-for-information-technology-devices-interconnects-and-packaging-9781849969673","title":"Materials for Information Technology: Devices, Interconnects and Packaging","description":"\u003cp\u003e • Author(s): Ehrenfried Zschech\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Metallurgy\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThe fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. \u003c\/p\u003e \u003cp\u003e\u003cem\u003eMaterials for Information Technology\u003c\/em\u003e is an up-to-date overview of current developments and R\u0026amp;D activities in the field of materials used for information technology with a focus on future applications. Included are: \u003c\/p\u003e \u003cp\u003ematerials for silicon-based semiconductor devices (including high-k gate dielectric materials); \u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003ematerials for nonvolatile memories; \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e \u003cp\u003ematerials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e \u003cp\u003ematerials for assembly and packaging \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003eThe latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e \u003cp\u003e\u003cstrong\u003eThe Engineering Materials and Processes\u003c\/strong\u003e series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45275156971671,"sku":"9781849969673","price":14534.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9781849969673.webp?v=1769282064","url":"https:\/\/atlanticbooks.com\/products\/materials-for-information-technology-devices-interconnects-and-packaging-9781849969673","provider":"Atlantic Books","version":"1.0","type":"link"}