{"product_id":"micro-and-opto-electronic-materials-and-structures-physics-mechanics-design-reliability-packaging-volume-i-materials-physics-materials-mechan-9780387279749","title":"Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan","description":"\u003cp\u003e • Author(s): Ephraim Suhir\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electrical\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cem\u003eMicro- and Opto-Electronic Materials and Structures: \u003c\/em\u003e\u003cem\u003ePhysics, Mechanics, Design, Reliability, Packaging\u003c\/em\u003e is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. \u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e\u003cstrong\u003eVolume I\u003c\/strong\u003e focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. \u003cstrong\u003eVolume II\u003c\/strong\u003e deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.\u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003eTopics addressed in the book include, but are not limited to, the following: \u003c\/p\u003e \u003cp\u003ephysics and mechanics of polymer materials; \u003c\/p\u003e \u003cp\u003eunderfills; \u003c\/p\u003e \u003cp\u003eelectrically conductive adhesives; \u003c\/p\u003e \u003cp\u003eplastic packages of IC devices; \u003c\/p\u003e \u003cp\u003eflip-chip packages; \u003c\/p\u003e \u003cp\u003ewirebond interconnects and metallurgical interconnections for harsh environments; \u003c\/p\u003e \u003cp\u003ereliability and stress testing and accelerated life testing; \u003c\/p\u003e \u003cp\u003esolder joint materials and technologies as well as lead-free solder materials and joints; \u003c\/p\u003e \u003cp\u003ereliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components; \u003c\/p\u003e \u003cp\u003ethermal phenomena in micro- and opto-electronic systems and thermal stresses; \u003c\/p\u003e \u003cp\u003eadhesion problems and solutions; \u003c\/p\u003e \u003cp\u003ethin film materials, physics and mechanics; \u003c\/p\u003e \u003cp\u003ephotorefractive materials and devices; \u003c\/p\u003e \u003cp\u003enanomaterials and nanotechnology; \u003c\/p\u003e \u003cp\u003emultiphysics modeling and optimization technologies; \u003c\/p\u003e \u003cp\u003eexperimental methods and techniques; \u003c\/p\u003e \u003cp\u003etesting methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others.\u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003eThe book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Hardcover","offer_id":45274035486871,"sku":"9780387279749","price":36335.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780387279749.webp?v=1769238523","url":"https:\/\/atlanticbooks.com\/products\/micro-and-opto-electronic-materials-and-structures-physics-mechanics-design-reliability-packaging-volume-i-materials-physics-materials-mechan-9780387279749","provider":"Atlantic Books","version":"1.0","type":"link"}