{"product_id":"proceedings-of-the-green-materials-and-electronic-packaging-interconnect-technology-symposium-epits-2024-26-27-august-ho-chi-minh-city-vietnam-9789819628704","title":"Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam","description":"\u003cp\u003e • Author(s): Dewi Suriyani Che Halin\u003cbr\u003e • Publisher: Springer Nature Switzerland AG\u003cbr\u003e • Publisher Imprint: Springer Nature Switzerland AG\u003cbr\u003e • BISAC: Physics - Condensed Matter\u003c\/p\u003e\u003cp\u003eThis book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology.\u003c\/p\u003e","brand":"Springer Nature Switzerland AG","offers":[{"title":"Hardcover","offer_id":47658052092055,"sku":"9789819628704","price":11752.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9789819628704.webp?v=1775816657","url":"https:\/\/atlanticbooks.com\/products\/proceedings-of-the-green-materials-and-electronic-packaging-interconnect-technology-symposium-epits-2024-26-27-august-ho-chi-minh-city-vietnam-9789819628704","provider":"Atlantic Books","version":"1.0","type":"link"}