{"product_id":"reliability-technology-for-integrated-circuit-packaging-9789819538843","title":"Reliability Technology for Integrated Circuit Packaging","description":"\u003cp\u003e • Author(s): Bin Zhou | Yunfei En | Si Chen\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - General\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan lang=\"EN-US\" style=\"mso-ascii-font-family: Calibri; mso-fareast-font-family: Calibri; mso-hansi-font-family: Calibri; mso-bidi-font-family: Calibri; color: #1f3864; mso-ansi-language: EN-US; mso-fareast-language: EN-IN; mso-no-proof: yes;\"\u003eOverview of Integrated Circuit Packaging Technology and Reliability.- Physical Properties and Reliability Characteristics of Integrated Circuit Packaging.- Failure Modes, Mechanisms, and Reliability of Plastic Packaging.- Failure Modes, Failure Mechanism and Reliability of Hermetic Packaging.- Failure Modes, Mechanisms, and Reliability of 3D Packaging.- Thermal Performance and Analysis Techniques of Integrated Circuit Packaging.- Mechanical Characteristics and Tests of Integrated Circuit Packaging.- Failure Analysis Techniques for Integrated Circuit Packaging.- Quality and Reliability Assurance in Integrated Circuit Packaging- Reliability of Integrated Circuit Board-level Assembly.\u003c\/span\u003e\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Hardcover","offer_id":47854010138775,"sku":"9789819538843","price":12810.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9789819538843.webp?v=1780037985","url":"https:\/\/atlanticbooks.com\/products\/reliability-technology-for-integrated-circuit-packaging-9789819538843","provider":"Atlantic Books","version":"1.0","type":"link"}