{"product_id":"rf-and-microwave-microelectronics-packaging-ii-9783319847191","title":"RF and Microwave Microelectronics Packaging II","description":"\u003cp\u003e • Author(s): Ken Kuang\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - Microelectronics\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eReviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eBridges the gap between low cost commercial and hi-res RF\/Microwave packaging technologies\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eEngages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers\u003cbr\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to \"RF and Microwave Microelectronics Packaging\" (2010) and covers the latest developments in thermal management, electrical\/RF\/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T\/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45274166526103,"sku":"9783319847191","price":6185.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9783319847191.webp?v=1769279090","url":"https:\/\/atlanticbooks.com\/products\/rf-and-microwave-microelectronics-packaging-ii-9783319847191","provider":"Atlantic Books","version":"1.0","type":"link"}