{"product_id":"silver-metallization-stability-and-reliability-9781849967051","title":"Silver Metallization: Stability and Reliability","description":"\u003cp\u003e • Author(s): Daniel Adams\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - Circuits - General\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eSilver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. \u003cem\u003eSilver Metallization: Stability and Reliability\u003c\/em\u003e is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology.\u003c\/p\u003e \u003cp\u003e\u003cem\u003eSilver Metallization: Stability and Reliability\u003c\/em\u003e provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: \u003c\/p\u003e \u003cul\u003e \u003cp\u003e \u003c\/p\u003e\n\u003cli\u003epreparation and characterization of elemental silver thin films and silver-metal alloys; \u003c\/li\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e\n\u003cli\u003eformation of diffusion barriers and adhesion promoters; \u003c\/li\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e\n\u003cli\u003eevaluation of the thermal stability of silver under different annealing conditions; \u003c\/li\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e\n\u003cli\u003eevaluation of the electrical properties of silver thin films under various processing conditions; \u003c\/li\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e\n\u003cli\u003emethods of dry etching of silver lines and the integration of silver with low-k dielectric materials. \u003c\/li\u003e \u003cp\u003e\u003c\/p\u003e\n\u003c\/ul\u003e \u003cp\u003eAs a valuable resource in this emerging field; \u003cem\u003eSilver Metallization: Stability and Reliability\u003c\/em\u003e will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45274919108759,"sku":"9781849967051","price":7345.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9781849967051.webp?v=1769281329","url":"https:\/\/atlanticbooks.com\/products\/silver-metallization-stability-and-reliability-9781849967051","provider":"Atlantic Books","version":"1.0","type":"link"}