{"product_id":"through-silicon-vias-for-3d-integration-9780071785143","title":"Through-Silicon Vias for 3D Integration","description":"\u003cp\u003e • Author(s): John H. Lau\u003cbr\u003e • Publisher: McGraw-Hill Companies\u003cbr\u003e • Publisher Imprint: McGraw-Hill Companies\u003cbr\u003e • BISAC: Electricity\u003c\/p\u003e\u003cp\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003c\/p\u003e\u003cbr\u003eA comprehensive guide to TSV and other enabling technologies for 3D integration\u003cp\u003eWritten by an expert with more than 30 years of experience in the electronics industry, \u003ci\u003eThrough-Silicon Vias for 3D Integration\u003c\/i\u003e provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.\u003c\/p\u003e\u003cp\u003eThis book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.\u003c\/p\u003e\u003cp\u003eCoverage includes: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eNanotechnology and 3D integration for the semiconductor industry\u003c\/li\u003e\n\u003cli\u003eTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing\u003c\/li\u003e\n\u003cli\u003eTSVs: mechanical, thermal, and electrical behaviors\u003c\/li\u003e\n\u003cli\u003eThin-wafer strength measurement\u003c\/li\u003e\n\u003cli\u003eWafer thinning and thin-wafer handling\u003c\/li\u003e\n\u003cli\u003eMicrobumping, assembly, and reliability\u003c\/li\u003e\n\u003cli\u003eMicrobump electromigration\u003c\/li\u003e\n\u003cli\u003eTransient liquid-phase bonding: C2C, C2W, and W2W\u003c\/li\u003e\n\u003cli\u003e2.5D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003e3D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003eThermal management of 3D IC integration\u003c\/li\u003e\n\u003cli\u003e3D IC packaging\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e","brand":"McGraw-Hill Companies","offers":[{"title":"Hardcover","offer_id":47573410939031,"sku":"9780071785143","price":18322.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780071785143.webp?v=1774892781","url":"https:\/\/atlanticbooks.com\/products\/through-silicon-vias-for-3d-integration-9780071785143","provider":"Atlantic Books","version":"1.0","type":"link"}