{"product_id":"tsv-3d-rf-integration-high-resistivity-si-interposer-technology-9780323996020","title":"TSV 3D RF Integration: High Resistivity Si Interposer Technology","description":"\u003cp\u003e • Author(s): Shenglin Ma\u003cbr\u003e • Publisher: Elsevier\u003cbr\u003e • Publisher Imprint: Elsevier\u003cbr\u003e • BISAC: Materials Science - General\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003ci\u003eTSV 3D RF Integration: High Resistivity Si Interposer Technology\u003c\/i\u003e systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. \u003c\/p\u003e \u003cp\u003eA series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. \u003c\/p\u003e","brand":"Elsevier","offers":[{"title":"Paperback","offer_id":45310438441111,"sku":"9780323996020","price":14490.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9780323996020.webp?v=1769287899","url":"https:\/\/atlanticbooks.com\/products\/tsv-3d-rf-integration-high-resistivity-si-interposer-technology-9780323996020","provider":"Atlantic Books","version":"1.0","type":"link"}