{"product_id":"wafer-level-3-d-ics-process-technology-9781441945624","title":"Wafer Level 3-D ICS Process Technology","description":"\u003cp\u003e • Author(s): Chuan Seng Tan\u003cbr\u003e • Publisher: Springer\u003cbr\u003e • Publisher Imprint: Springer\u003cbr\u003e • BISAC: Electronics - Microelectronics\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003eFrom the Back Cover\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cem\u003eWafer Level 3-D ICs Process Technology\u003c\/em\u003e focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the \"Holy Grail\" of system integration. \u003c\/p\u003e \u003cp\u003e\u003c\/p\u003e \u003cp\u003e\u003cem\u003eWafer Level 3-D ICs Process Technology\u003c\/em\u003e is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Paperback","offer_id":45274052427927,"sku":"9781441945624","price":11017.0,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0666\/3471\/1191\/files\/9781441945624.webp?v=1769238597","url":"https:\/\/atlanticbooks.com\/products\/wafer-level-3-d-ics-process-technology-9781441945624","provider":"Atlantic Books","version":"1.0","type":"link"}