• ISBN13: 9780387765327
• Binding: Hardcover
• Subject: Engineering
• Publisher: Springer Verlag
• Publisher Imprint: Springer
• Publication Date: January 1, 2009
• Pages: 410
• Original Price: EUR 199.99
• Language: English
• Edition: N/A
• Item Weight: 658 grams
• BISAC Subject(s): Electronics / Microelectronics, Optics, and Engineering (General)

From the Back Cover

Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration.

Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.