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Reliability Of Rohs-Compliant 2D And 3D Ic Interconnects

by Lau
Save 35% Save 35%
Current price ₹7,419.00
Original price ₹11,413.00
Original price ₹11,413.00
Original price ₹11,413.00
(-35%)
₹7,419.00
Current price ₹7,419.00

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Book cover type: Hardcover
  • ISBN13: 9780071753791
  • Binding: Hardcover
  • Subject: Engineering
  • Publisher: McGraw Hill
  • Publisher Imprint: McGrawHill
  • Publication Date:
  • Pages: 640
  • Original Price: USD 125.0
  • Language: English
  • Edition: N/A
  • Item Weight: 908 grams
  • BISAC Subject(s): Electronics / Optoelectronics

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Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

  • 2D and 3D IC lead-free interconnects
  • CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
  • Lead-free (SACX) solder joints
  • Low-temperature lead-free (SnBiAg) solder joints
  • Solder joints with voids, high strain rate, and high ramp rate
  • VCSEL and LED lead-free interconnects
  • 3D LED and 3D MEMS with TSVs
  • Chip-to-wafer (C2W) bonding and lead-free interconnects
  • Wafer-to-wafer (W2W) bonding and lead-free interconnects
  • 3D IC chip stacking with low-temperature bonding
  • TSV interposers and lead-free interconnects
  • Electromigration of lead-free microbumps for 3D IC integration

Lau, John H.: - John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Industrial Technology Research Institute (ITRI), Taiwan. He has published 15 books with McGraw-Hill, including Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies.

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