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Design and Application of Intelligent Thermally Conductive Materials

by Wei Feng
Save 17% Save 17%
Current price ₹28,043.00
Original price ₹33,652.00
Original price ₹33,652.00
Original price ₹33,652.00
(-17%)
₹28,043.00
Current price ₹28,043.00

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Book cover type: Paperback
  • ISBN13: 9780443404092
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Elsevier
  • Publisher Imprint: Elsevier
  • Publication Date:
  • Pages: 374
  • Original Price: GBP 196.99
  • Language: English
  • Edition: N/A
  • Item Weight: 282 grams
  • BISAC Subject(s): Materials Science / General

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.

For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.

Feng, Wei: - Professor Wei Feng based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials

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