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Fracture of Engineering Materials and Structures

by S. H. Teoh
Save 35% Save 35%
Current price ₹3,486.00
Original price ₹5,362.00
Original price ₹5,362.00
Original price ₹5,362.00
(-35%)
₹3,486.00
Current price ₹3,486.00

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Book cover type: Hardcover
  • ISBN13: 9781851666720
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 931
  • Original Price: EUR 49.99
  • Language: English
  • Edition: 1991
  • Item Weight: 1556 grams
  • BISAC Subject(s): Fracture Mechanics, Materials Science / General, and General

Recent advances in the field of fracture of engineering materials and structures have increasingly indicated its multidisciplinary nature. This area of research now involves scientists and engineers who work in materials science, applied mathematics and mechanics, and also computer scientists. The present volume, which contains the Proceedings of the Joint FEFG/lCF International Conference on Fracture of Engineering Materials and Structures held in Singapore from the 6th to 8th of August 1991, is a testimony of this multidisciplinary nature. This International Conference was the Second Symposium of the Far East Fracture Group (FEFG) and thus provided a unique opportunity for researchers and engineers in the Far East region to exchange and acquire knowledge of new advances and applications in fracture. The Conference was also the Inter-Quadrennial International Conference on Fracture (ICF) for 1991 and thus appealed to researchers in the international arena who wished to take advantage of this meeting to present their findings. The Conference has brought together over 130 participants from more than 24 countries, and they represented government and industrial research laboratories as well as academic institutions. It has thus achieved its objective of bringing together scientists and engineers with different backgrounds and perspectives but with . a common interest in new developments in the fracture of engineering materials and structures. This volume contains 4 keynote papers, 4 invited papers and 130 contributed papers.

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