Search results for “[subject: industrial-design-packaging]”

• Author(s): Daniel Lu • Publisher: Springer • Publisher Imprint: Springer • BISAC: Electronics - Circuits - GeneralFrom the Back CoverThis second edition continues to be the most comprehensive review on the developments in advanced electronic pa...

• Author(s): Daniel Lu • Publisher: Springer • Publisher Imprint: Springer • BISAC: Electronics - Circuits - GeneralFrom the Back CoverThis second edition continues to be the most comprehensive review on the developments in advanced electronic pa...

• Author(s): Daniel Lu • Publisher: Springer • Publisher Imprint: Springer • BISAC: Electronics - MicroelectronicsFrom the Back CoverSignificant progress has been made in advanced packaging in recent years. Several new packaging techniques have b...