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Products
CODES+ISS11 Proceedings of the 9th IEEE/ACM International Conference on Hardware/Software Code Design and System Synthesis
Codes Iss 11 Conference Committee
Paperback
• Author(s): Codes Iss 11 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: GeneralEmbedded Systems Week is an exciting event which brings together conferences, tutorials, and workshops centered on various aspects of embedde...
View full detailsLCTES 2010 Proceedings of the 2010 SIGPLAN/SIGBED Conference on Languages, Computers &Tools for Embedded Systems
Lctes 10 Conference Committee
Paperback
• Author(s): Lctes 10 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: Programming Languages - GeneralThe CPSWeek brings together five leading conferences - HSCC, ICCPS, IPSN, LCTES, and RTAS - as well as several workshops ...
View full detailsCases 12 Proceedings of the 2012 ACM International Conference on Compilers, Architectures and Synthesis for Embedded Systems
Cases 12 Conference Committee
Paperback
• Author(s): Cases 12 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: Computer Science
Lctes 13 Proceedings of the 2013 ACM Sigplan/Sigbed Conference on Languages, Compilers and Tools for Embedded Systems
Lctes 13 Conference Committee
Paperback
• Author(s): Lctes 13 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: General
Eurosys 2011 Proceedings of 2011 Conference
Eurosys Conference Committee
Paperback
• Author(s): Eurosys Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: Programming Languages - GeneralThe EuroSys conferences are organised by EuroSys, the European Chapter of SIGOPS, sponsored by ACM SIGOPS. The EuroSys con...
View full detailsTEI 11 Proceedings of the Fifth International Conference on Tangible, Embedded and Embodied Interaction
Tei Conference Committee
Paperback
• Author(s): Tei Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: Computer ScienceTEI is dedicated to presenting the latest results in tangible, embedded, and embodied interaction. The work presented at TEI addresses HCI is...
View full detailsSenSys 15 13th ACM Conference on Embedded Networked Sensor Systems
Sensys 15 Conference Committee
Paperback
• Author(s): Sensys 15 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: General
Lctes 14 Sigplan Sigbed Conference on Language Compilers
Lctes 14 Conference Committee
Paperback
• Author(s): Lctes 14 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: General
Tei'19: Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
Tei'19
Paperback
• Author(s): Tei'19 • Publisher: ACM • Publisher Imprint: ACM • BISAC: Social Aspects - Human-Computer InteractionWelcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona...
View full detailsMobySys 11 Proceedings of the 9th International Conference on Mobile Systems, Applications and Services
Mobisys 11 Conference Committee
Paperback
• Author(s): Mobisys 11 Conference Committee • Publisher: ACM • Publisher Imprint: ACM • BISAC: GeneralThe annual MobiSys Conference seeks to present innovative and significant research on the design, implementation, usage, and evaluation of mobi...
View full detailsTei '18: Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction
Acm Sigchi
Paperback
• Author(s): Acm Sigchi • Publisher: ACM • Publisher Imprint: ACM • BISAC: Human-Computer Interaction (HCI)Welcome to ACM TEI'18, the 12th International Conference on Tangible, Embedded and Embodied Interactions, hosted at KTH, Royal Institute of...
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