Search results for “[subject: nanoscience]”

• Author(s): Andrei L. Tchougreeff • Publisher: Springer Verlag • Publisher Imprint: Springer V • Subject: Engineering • BISAC: Chemistry - Physical & TheoreticalFrom the Back CoverHybrid Methods of Molecular Modeling is a self-contained adva...

• Author(s): Bharat Bhushan | Harald Fuchs • Publisher: Springer Verlag • Publisher Imprint: Springer V • Subject: Sociology and Anthropology • BISAC: Nanotechnology & MEMSThe volumes XI, XII and XIII examine the physical and technical founda...

• Author(s): Bharat Bhushan | Harald Fuchs | Masahiko Tomitori • Publisher: Springer Verlag • Publisher Imprint: Springer V • Subject: Engineering • BISAC: Nanotechnology & MEMSThe success of the Springer Series Applied Scanning Probe Methods...

• Author(s): Zhang | Zhuomin M. • Publisher: Springer Verlag • Publisher Imprint: Springer • Subject: Engineering • BISAC: Mechanics - ThermodynamicsFrom the Back CoverThis substantially updated and augmented second edition adds over 200 pages of...

• Author(s): Bharat Bhushan | Harald Fuchs | Masahiko Tomitori • Publisher: Springer Verlag • Publisher Imprint: Springer V • Subject: Engineering • BISAC: Nanotechnology & MEMSThe success of the Springer Series Applied Scanning Probe Methods...

• Author(s): Fahlman | Bradley D. • Publisher: Springer Verlag • Publisher Imprint: Springer • Subject: Engineering • BISAC: Materials Science - CeramicsFrom the Back CoverThis award-winning textbook delivers an earnest and comprehensive treatmen...

• Author(s): Giovanni DeMicheli | Others • Publisher: Springer Verlag • Publisher Imprint: Springer V • Subject: Engineering • BISAC: Electronics - Circuits - GeneralFrom the Back CoverDeMicheli, et. al., Nanosystems Design and Technology This b...

• Author(s): James E. Morris • Publisher: Springer Verlag • Publisher Imprint: Springer • Subject: Engineering • BISAC: Nanotechnology & MEMSAbout the Book Nanotechnology is now being applied to microelectronics packaging, primarily in the ap...