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Michel Soustelle
Paperback
• Author(s): Michel Soustelle • Publisher: Wiley • Publisher Imprint: Wiley-ISTE • Subject: Engineering • BISAC: Mechanics - ThermodynamicsThis book offers advanced students, in 7 volumes, successively characterization tools phases, the study of ...
View full detailsJean-Michel Bergheau
Hardcover
• Author(s): Jean-Michel Bergheau • Publisher: Wiley • Publisher Imprint: Wiley-ISTE • Subject: Engineering • BISAC: Numerical AnalysisThe numerical simulation of manufacturing processes and of their mechanical consequences is of growing interest...
View full detailsJ. L. Meriam, L.G. Kraige
Paperback
• Author(s): J. L. Meriam | L.G. Kraige • Publisher: Wiley • Publisher Imprint: John Wiley • Subject: EngineeringOver the past 50 years, Meriam & Kraige's Engineering Mechanics: Dynamics has established a highly respected tradition of excelle...
View full detailsGrigorios Dimitriadis
Hardcover
• Author(s): Grigorios Dimitriadis • Publisher: Wiley • Publisher Imprint: Wiley • Subject: Engineering • BISAC: Aeronautics & AstronauticsFrom the Back CoverA comprehensive overview of unsteady aerodynamics and its applications The study of ...
View full detailsBirk
Hardcover
• Author(s): Birk • Publisher: Wiley • Publisher Imprint: Wiley • Subject: Engineering • BISAC: MechanicalFrom the Back CoverBRIDGING THE INFORMATION GAP BETWEEN FLUID MECHANICS AND SHIP HYDRODYNAMICS Fundamentals of Ship Hydrodynamics is designe...
View full detailsSeiichi Nomura
Hardcover
• Author(s): Seiichi Nomura • Publisher: Wiley • Publisher Imprint: Wiley • Subject: Engineering • BISAC: Mechanics - GeneralDemonstrates the simplicity and effectiveness of Mathematica as the solution to practical problems in composite materials...
View full detailsChin
Hardcover
• Author(s): Chin • Publisher: American Ceramic • Publisher Imprint: American Ceramic • Subject: Engineering • BISAC: Aeronautics & AstronauticsAbout the Book A powerful new monograph from an aerodynamicist reviewing modern conventional aerod...
View full detailsJoseph J. S. Shang
Hardcover
• Author(s): Joseph J. S. Shang • Publisher: Wiley • Publisher Imprint: John Wiley • BISAC: Electronics - GeneralFrom the Back CoverPresents numerical algorithms, procedures, and techniques required to solve engineering problems relating to the i...
View full detailsAtul Tiwari, Baldev Raj
Hardcover
• Author(s): Atul Tiwari | Baldev Raj • Publisher: Wiley • Publisher Imprint: Wiley-Scri • Subject: Engineering • BISAC: Fracture MechanicsStrong bonds form stronger materials. For this reason, the investigation on thermal degradation of material...
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