Search results for “[subject: computer-architecture]”

• Author(s): N. Senthil KumarM. SaravananS. JeevananthanS.K.Shah | M. Saravanan | S. Jeevananthan • Publisher: Oxford UP • Publisher Imprint: Oxford UP • Subject: Engineering • BISAC: GeneralMicroprocessors and Interfacing is a textbook for under...

• Author(s): Forbes Guthrie | Scott Lowe | Maish Saidel-Keesing • Publisher: Wiley • Publisher Imprint: Sybex • Subject: EngineeringThe only book focused on designing VMware vSphere implementations. VMware vSphere is the most widely deployed virt...

• Author(s): Blackler • Publisher: Taylor & Francis • Publisher Imprint: CRC Press • Subject: Engineering • BISAC: Human-Computer Interaction (HCI)This book explores recent research in intuitive interaction worldwide by a range of leading aca...

• Author(s): LaMeres • Publisher: Springer Verlag • Publisher Imprint: Springer • Subject: Engineering • BISAC: Electronics - Circuits - GeneralFrom the Back CoverThis textbook introduces readers to the fundamental hardware used in modern compute...

• Author(s): Jonathan A. Dell • Publisher: Wiley • Publisher Imprint: Wiley • Subject: Engineering • BISAC: Electronics - Circuits - GeneralFrom the Back CoverMany computer applications require microprocessors to reliably interconnect and communi...

• Author(s): Serge Luryi | Jimmy Xu | Alexander Zaslavsky • Publisher: Wiley • Publisher Imprint: Wiley-IEEE • Subject: Engineering • BISAC: Electronics - MicroelectronicsLeaders in the field predict the future of the microelectronics industry Th...

• Author(s): O.V. Gnana Swathika • Publisher: Taylor & Francis • Publisher Imprint: CRC Press • Subject: EngineeringA smart building is the state-of-art in building with features that facilitates informed decision making based on the availabl...

• Author(s): Bahram Javidi | Enrique Tajahuerce | Pedro Andres • Publisher: Wiley • Publisher Imprint: Wiley-IEEE • Subject: Engineering • BISAC: Imaging SystemsFrom the Back CoverMulti-dimensional Imaging brings together research from various fi...

• Author(s): Sakuma Katsuyuki • Publisher: Taylor & Francis • Publisher Imprint: CRC Press • Subject: Engineering • BISAC: Electronics - Circuits - GeneralCurrently, the term 3D integration includes a wide variety of different integration met...

• Author(s): Ventre • Publisher: Springer Verlag • Publisher Imprint: Springer • Subject: Engineering • BISAC: Engineering (General)From the Back CoverThis textbook offers a comprehensive coverage of the fundamentals of calculus, linear algebra a...

• Author(s): Song • Publisher: Wiley • Publisher Imprint: Wiley • Subject: Engineering • BISAC: Mechanics - GeneralFrom the Back CoverAn Informative Look at the Theory, Computer Implementation, and Application of the Scaled Boundary Finite Elemen...