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Penhallow, John
Paperback
• Author(s): Penhallow, John • Publisher: MixIG • Publisher Imprint: MixIG • Subject: Engineering • BISAC: Industrial Design - PackagingThis book in the Label Academy series examines each of the main end-user markets in turn. It describes how the...
View full detailsFroes Francis
Paperback
• Author(s): Froes Francis • Publisher: Elsevier • Publisher Imprint: Elsevier • Subject: Engineering • BISAC: MetallurgyTitanium for Consumer Applications is the first book to tie together the metallurgical advantages of titanium in consumer app...
View full detailsDan Catlin
Paperback
• Author(s): Dan Catlin • Publisher: Createspace Independent Publishing Platform • Publisher Imprint: Createspace Independent Publishing Platform • Subject: Engineering • BISAC: MechanicalThis book addresses the issues and benefits of converting ...
View full detailsYasuhisa Omura, Abhijit Mallik, Naoto Matsuo
Hardcover
• Author(s): Yasuhisa Omura | Abhijit Mallik | Naoto Matsuo • Publisher: Wiley • Publisher Imprint: Wiley-IEEE • Subject: Engineering • BISAC: Electronics - TransistorsHelps readers understand the physics behind MOS devices for low-voltage and lo...
View full detailsMarc Gelhausen, Peter Berster, Dieter Wilken
Paperback
• Author(s): Marc Gelhausen | Peter Berster | Dieter Wilken • Publisher: Elsevier • Publisher Imprint: Acad Pr • Subject: Engineering • BISAC: GeneralWhen predicting the future of air traffic development, it is imperative for researchers and plan...
View full detailsSuhir
Hardcover
• Author(s): Suhir • Publisher: Taylor & Francis • Publisher Imprint: CRC Press • Subject: Engineering • BISAC: Materials Science - Electronic MaterialsAvoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analyt...
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