Skip to content

Booksellers & Trade Customers: Sign up for online bulk buying at trade.atlanticbooks.com for wholesale discounts

Booksellers: Create Account on our B2B Portal for wholesale discounts

3D IC Integration and Packaging

by John H. Lau
Save 17% Save 17%
Current price ₹23,489.00
Original price ₹28,187.00
Original price ₹28,187.00
Original price ₹28,187.00
(-17%)
₹23,489.00
Current price ₹23,489.00

Imported Edition - Ships in 18-21 Days

Free Shipping in India on orders above Rs. 500

Request Bulk Quantity Quote
+91
Book cover type: Hardcover
  • ISBN13: 9780071848060
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: McGraw-Hill Companies
  • Publisher Imprint: McGraw-Hill Companies
  • Publication Date:
  • Pages: 480
  • Original Price: USD 229.0
  • Language: English
  • Edition: N/A
  • Item Weight: 1016 grams
  • BISAC Subject(s): Electrical

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.




A comprehensive guide to 3D IC integration and packaging technology


3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.


3D IC Integration and Packaging covers:


- 3D integration for semiconductor IC packaging
- Through-silicon vias modeling and testing
- Stress sensors for thin-wafer handling and strength measurement
- Package substrate technologies
- Microbump fabrication, assembly, and reliability
- 3D Si integration
- 2.5D/3D IC integration
- 3D IC integration with passive interposer
- Thermal management of 2.5D/3D IC integration
- Embedded 3D hybrid integration
- 3D LED and IC integration
- 3D MEMS and IC integration
- 3D CMOS image sensors and IC integration
- PoP, chip-to-chip interconnects, and embedded fan-out WLP

Trusted for over 49 years

Family Owned Company

Secure Payment

All Major Credit Cards/Debit Cards/UPI & More Accepted

New & Authentic Products

India's Largest Distributor

Need Support?

Whatsapp Us