3D Printed Devices: Sensors and Actuators
3D printing or additive manufacturing has been one of the most revolutionary developments in rapid prototyping. This type of manufacturing has now developed to the degree that it can be used to manufacture complex devices, particularly sensors and actuators, without the need of traditional molds. The engineering potential that emerge from the creation of moldless devices are boundless, and engineers and materials scientists are urgently in need of increased familiarity with these possibilities
3D Printed Devices meets this need with a timely, comprehensive overview to 3D printing techniques in the field of sensors and actuators. Students, researchers, and scientists in industry can all benefit from this volume's robust knowledge of both the current and future state of this growing field. Thoroughly engaged with both the possibilities and limitations of 3D printed devices, the book is a must-own for anyone looking to stand on the cutting edge of our technological future.
3D Printed Devices readers will also find: *Analysis of both physical and chemical sensors, as well as different types of actuators including electrically or thermally actuated *Detailed discussion of sensor and actuator materials including gels, polymers, composites, and more *Detailed know-how required to design, fabricate, and innovate 3D printed devices
3D Printed Devices is an indispensable resource for academic researchers and industrial scientists in engineering and the physical sciences. It caters to those working in the cutting-edge fields of sensors, robotics, 3D printing, electronic materials, and electrochemistry. This book is also perfect for advanced undergraduate and graduate students eager to delve into these dynamic and rapidly evolving areas.
Ajit Khosla, PhD
Ajit Khosla is a distinguished professor in the School of Advanced Materials and Nanotechnology at the Xidian University, and at Yamagata University. In 2012, he received his doctorate degree in Microelectronics stream from School of Engineering Science, Simon Fraser University ()SFU, Canada, where he was awarded the 2012 Dean of Graduate Studies Convocation Medal as one of SFU's most outstanding graduate students. He is a fellow of Royal Society of Chemistry, United Kingdom and Fellow of Electrochemical Society, United States. He is the author of over 185 publications in refereed journals, 5 books and 5 US patents. He is Founding Editor-in-Chief of Electrochemical Society's first gold open access journals, ECS Sensors Plus and Editor Electrochemical Society's family of journals. He has organized over 50 conferences, mini colloquiums and workshops along with IEEE, ECS, ACS and IoP. He is a long-standing member of IEEE and has been serving as associate editor for IEEE Access. His research program is interdisciplinary in nature that bridges over disciplines, with a focus on development micro-nano-fabricated chemical and biological sensors Turnkey systems with applications in healthcare, environmental monitoring and restoration (fauna and fauna), additive manufacturing, sustainable design and manufacturing, and clean water that address to real world problems, thereby improving quality of life.
Kunal Singh, PhD
Dr. Kunal Singh earned his B-Tech degree in Mechanical Engineering from Kurukshetra University, India, in 2009, followed by M-Tech in Thermal Engineering from Thapar University, Patiala, India in 2011, and a Ph.D in Soft Robotics from Maharaja Agrasen University, Himachal Pradesh, India. Currently, he is working as an Assistant Professor in the Mechanical Engineering Department of Maharaja Agrasen University. He has over 10 years of experience in research and teaching in Mechanical Engineering, with particular emphasis on mechatronics, automation, soft robotics, and 3D printing, manifesting his deep interest and dedication in these areas. He has recently been awarded IOP Trusted Reviewer status in recognition of his exceptionally high level of peer review competency. He is also an active contributor and reviewer for several renowned journals, including IEEE Transactions on Instrumentation and Measurement and IOP Smart Materials and Structures.
