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Advances in 3D Integrated Circuits and Systems

by Hao Yu , Chuan Seng Tan
Save 17% Save 17%
Current price ₹14,443.00
Original price ₹17,332.00
Original price ₹17,332.00
Original price ₹17,332.00
(-17%)
₹14,443.00
Current price ₹14,443.00

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Book cover type: Hardcover
  • ISBN13: 9789814699006
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: World Scientific Publishing Company
  • Publisher Imprint: World Scientific Publishing Company
  • Publication Date:
  • Pages: 392
  • Original Price: USD 141.0
  • Language: English
  • Edition: N/A
  • Item Weight: 567 grams
  • BISAC Subject(s): Electronics / Circuits / Integrated

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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