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Carbon Nanotubes for Interconnects: Process, Design and Applications

by Aida Todri-Sanial
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Current price ₹7,277.00
Original price ₹11,194.00
Original price ₹11,194.00
Original price ₹11,194.00
(-35%)
₹7,277.00
Current price ₹7,277.00

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Book cover type: Hardcover
  • ISBN13: 9783319297446
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 333
  • Original Price: EUR 99.99
  • Language: English
  • Edition: 2017
  • Item Weight: 663 grams
  • BISAC Subject(s): Electronics / Circuits / General, Computer Architecture, and Hardware / Mainframes & Minicomputers

From the Back Cover
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

  • Provides a single-source reference on carbon nanotubes for interconnect applications;
  • Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects;
  • Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

Aida Todri-Sanial is a research scientist at the French National Center for Scientific Research (CNRS) attached to Laboratoire of Informatique, Robotique, Microelectronics of Montpellier (LIRMM) in junction with University of Montpellier 2, France. She is also a permanent faculty member in the Microelectronics department at LIRMM. She received her Ph.D. in Electrical & Computer Engineering at the University of California Santa Barbara, USA in 2009. She received the B.S. and M.S. degrees from Bradley University, IL, USA and California State University at Long Beach, CA, USA in 2001 and 2003, respectively. From August 2009 to September 2010, she was with the Computing Division at Fermilab, IL, USA where she was the recipient of John Bardeen Fellowship Award. Previously, she has held several summer and visiting research positions: STMicroelectronics, FR (2008), IBM TJ Watson Research Center, Yoktown, NY, USA (2006, 2007), Mentor Graphics Corporation, CA, USA (2005), and Cadence DesignSystems, CA, USA (2002-2004).

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