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Chiplet Design and Heterogeneous Integration Packaging

by John H. Lau
Save 35% Save 35%
Current price ₹8,814.00
Original price ₹13,559.00
Original price ₹13,559.00
Original price ₹13,559.00
(-35%)
₹8,814.00
Current price ₹8,814.00

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Book cover type: Paperback
  • ISBN13: 9789811999192
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 525
  • Original Price: EUR 119.99
  • Language: English
  • Edition: 2023
  • Item Weight: 918 grams
  • BISAC Subject(s): Electronics / General and Nanotechnology & MEMS

For Internal Use Only:

John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

Trusted for over 49 years

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