The relentless pace of technological advancement, particularly in telecommunications, is reshaping how we connect and communicate. What once took a decade to standardize now evolves in just a few years, blurring generational divides and delivering seamless transitions to users. Against this backdrop, Considerations on Novel Network Edge Physical Node Architectures explores the complex paradigm of 6G mobile communications--anticipated to emerge around 2030--and casts a longer-term vision toward future networks (FNs).
The scientific community has been engaged in 6G research since 2017-2018, defining use cases, key enabling technologies (KETs), and performance indicators (KPIs). Ambitious targets include peak data rates of 1 Tbps, average user rates of 10-100 Gbps, sub-0.1 ms latency, and reliability greater than 10⁻⁸. Application domains span holographic communications, digital twins, multi-sensory extended reality (XR), tactile and haptic interactions, and integrated space-terrestrial networks.
While these expectations hold the promise of a more interconnected world, realizing them demands a fundamental shift in approach. The projected density of 10-100 million smart devices per square kilometer in 6G networks cannot be addressed through conventional hardware-software co-design alone. This book proposes new ways of conceiving the physical building blocks of edge intelligence (EI), where intelligence is embedded at the network's edge.
Central to this vision is the use of micro- and nanotechnologies (MEMS/NEMS) to create miniaturized sensors, actuators, and transducers (SATs) that serve as distributed intelligence units. These physical innovations are examined alongside non-physical enablers such as artificial intelligence (AI) and federated learning (FL), illustrating how a holistic integration of technologies can enable practical, scalable applications.
By bridging physical and digital innovations, Considerations on Novel Network Edge Physical Node Architectures aims to inject fresh ideas into scientific discourse and provide a foundation for turning the ambitious visions of 6G and future networks into reality. It is an essential resource for researchers, engineers, and industry professionals seeking to shape the next generation of telecommunications infrastructure.
Jacopo Iannacci (Senior Member, IEEE) was born in Bologna, Italy, in 1977. He received his M.Sc. (Laurea) degree in electronics engineering from the University of Bologna, Italy, in 2003, and his Ph.D. in information and telecommunications technology from the University of Bologna, Italy, in 2007. He received Habilitation as Full Professor in Electronics from the Italian Ministry of University and Research (MUR), in 2021. He worked in 2005 and 2006 as visiting researcher at the DIMES Technology Center (currently Else Kooi Lab) of the Technical University of Delft, the Netherlands, focusing on the development of innovative packaging and integration technology solutions for RF-MEMS devices. In 2016, he visited as seconded researcher the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany, to conduct high-frequency characterization of RF-MEMS components jointly with the RF & Smart Sensor Systems Department at IZM. Since 2007, he has been a researcher (permanent staff) at the Center for Sensors & Devices of Fondazione Bruno Kessler, in Trento, Italy. His research interests and experience fall in the areas of finite element method multi-physics modelling, compact (analytical) modeling, design, optimization, integration, packaging, experimental characterization and testing for reliability of MEMS and RF-MEMS devices and networks for sensors and actuators, energy harvesting (EH-MEMS) and telecommunication systems, with applications in the fields of 5G, Internet of Things, as well as 6G, tactile internet and Super-IoT. Dr. Iannacci has authored more than 180 scientific contributions, including international journal papers, conference proceedings, books, book chapters and one patent. He is Associate Editor of Springer Microsystem Technologies, Series Editor of the IEEE Communications Magazine, and Distinguished Lecturer of the IEEE Communications Society 2025-2026.
Dr. Vinod Belwanshi is a Scientist in the Materials Engineering Division at CSIR-National Metallurgical Laboratory (CSIR-NML), Jamshedpur, JH, India. He also holds an Honorary Research Fellow position at the University of Glasgow, UK, and is recognized as an Assistant Professor at the Academy of Scientific and Innovative Research (AcSIR), Ghaziabad, UP, India. He received his M.Tech. in Instrumentation from the Indian Institute of Technology, Kharagpur, India. He was awarded the prestigious Department of Atomic Energy Graduate Fellowship Scheme (DGFS) to pursue his Ph.D. in Engineering Sciences from Bhabha Atomic Research Centre, Mumbai, India, under the aegis of the Homi Bhabha National Institute, Mumbai, India. Dr. Belwanshi is also a recipient of the prestigious Ramanujan Fellowship from the Department of Science and Technology, Government of India, aimed at attracting exceptional Indian researchers working abroad to return to India. Dr. Belwanshi worked as a Senior Project Research Scientist and Visiting Researcher at the Indian Institute of Technology Bombay, Mumbai, India, where he focused on memory devices and, micro/nanoelectronic devices based on SU-8 and carbon nanomaterials. He has served as a Research Associate at the University of Glasgow, UK where he worked on MEMS gravimeters. His current research focuses on non-destructive evaluation and testing and micro/nano electromechanical systems technologies for harsh environments generally present in nuclear, aerospace, and industrial sectors. He has published his research widely in reputed journals and conferences. He is a life member of the Institute of Smart Structures and Systems (ISSS) and the Indian Society for Non-destructive Testing (ISNT), and a member of the IEEE Sensors Council, and IEEE MEMS Technical Committee.
Dr. Kandarpa Kumar Sarma, currently Professor, Department of Electronics and Communication Engineering, Gauhati University, Guwahati, Assam, India specializes in mobile communication, artificial intelligence, human-computer interaction, cognitive and software defined radio, speech processing and antenna design. He earned his Ph.D. in mobile communication (2012) from IIT Guwahati. Furthermore, he completed PostDoc research in the area of application of AI in mobile communication from Technical University Sofia, Bulgaria. Currently he is associated with research in the areas of pandemic compliant smart infrastructure development, AI aided approaches in dense wireless networks, cognitive spectrum management, electronic warfare and high data rate micro-strip patch antenna designs. He has authored and edited twelve books. He has been a TPC member of over two hundred international conferences. He is a Senior Member of IEEE (USA) and a fellow of Institution of Electronics and Telecommunication Engineers (India). He serves as the Editor in Chief, International Journal of Intelligent Systems Design and Computing, Inderscience, and Associate Editor, Network: Computation in Neural Systems.
