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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

by Sung Kyu Lim
Save 35% Save 35%
Current price ₹10,900.00
Original price ₹16,769.00
Original price ₹16,769.00
Original price ₹16,769.00
(-35%)
₹10,900.00
Current price ₹10,900.00

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Book cover type: Hardcover
  • ISBN13: 9781441995414
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 560
  • Original Price: EUR 149.99
  • Language: English
  • Edition: 2012
  • Item Weight: 885 grams
  • BISAC Subject(s): Electronics / Circuits / General, Computer Architecture, and Nanotechnology & MEMS

From the Back Cover

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process.

  • Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability.
  • Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs.
  • Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance.
  • Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and full-chip timing variations, and the impact of package elements.

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