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Electronic Packaging for High Reliability, Low Cost Electronics

by R. R. Tummala
Save 35% Save 35%
Current price ₹10,900.00
Original price ₹16,769.00
Original price ₹16,769.00
Original price ₹16,769.00
(-35%)
₹10,900.00
Current price ₹10,900.00

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Book cover type: Paperback
  • ISBN13: 9789048150854
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 296
  • Original Price: EUR 149.99
  • Language: English
  • Edition: N/A
  • Item Weight: 467 grams
  • BISAC Subject(s): Electronics / General, Optics, and Materials Science / Electronic Materials

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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