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Feature Paper Collection in the Section 'Electrical, Electronics and Communications Engineering'

by Alexander Barkalov , Larysa Titarenko , Kazimierz Krzywicki
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₹12,607.00
Original price ₹12,607.00
Original price ₹12,607.00
₹12,607.00
Current price ₹12,607.00

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Book cover type: Hardcover
  • ISBN13: 9783725875795
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Mdpi AG
  • Publisher Imprint: Mdpi AG
  • Publication Date:
  • Pages: 306
  • Original Price: USD 116.94
  • Language: English
  • Edition: N/A
  • Item Weight: 858 grams
  • BISAC Subject(s): Computer Science

This Reprint presents a current overview of research in electrical, electronics, and communications engineering by bringing together contributions that address both core engineering problems and emerging interdisciplinary applications. The published works cover a broad range of topics including programmable hardware and digital system design, embedded and wearable technologies, communication networks, signal processing, antenna and microwave solutions, and cybersecurity and intelligent data-driven methods. Particular attention is given to implementation-oriented research in which theoretical concepts are translated into practical architectures, algorithms, and engineering solutions. Across the collected papers, readers will find studies focused on performance improvement, reliability optimization, secure operation, and the integration of modern computational methods into complex electronic and communication environments. The Reprint also reflects on the growing convergence of hardware, software, and intelligent processing in contemporary engineering practice. In addition to advances in design methodologies and system architectures, the included research highlights applications relevant to next generation infrastructures, connected devices, and advanced analytical systems. Taken together, these contributions provide a broad yet coherent picture of recent progress in the field and illustrate how electrical, electronics, and communications engineering continue to evolve through innovation at both the component and system level.

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