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Foldable Flex and Thinned Silicon Multichip Packaging Technology

by John W. Balde
Save 35% Save 35%
Current price ₹11,017.00
Original price ₹16,949.00
Original price ₹16,949.00
Original price ₹16,949.00
(-35%)
₹11,017.00
Current price ₹11,017.00

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Book cover type: Paperback
  • ISBN13: 9781461349778
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 347
  • Original Price: EUR 149.99
  • Language: English
  • Edition: Softcover Repri
  • Item Weight: 561 grams
  • BISAC Subject(s): Electronics / General, Manufacturing, and Chemistry / Physical & Theoretical

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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