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High-Frequency Characterization of Electronic Packaging

by Luc Martens
Save 35% Save 35%
Current price ₹7,345.00
Original price ₹11,299.00
Original price ₹11,299.00
Original price ₹11,299.00
(-35%)
₹7,345.00
Current price ₹7,345.00

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Book cover type: Paperback
  • ISBN13: 9781461375739
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 158
  • Original Price: EUR 99.99
  • Language: English
  • Edition: Softcover Repri
  • Item Weight: 275 grams
  • BISAC Subject(s): Electronics / General, Electrical, and Robotics

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

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