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International Conference on Cloud Computing and Computer Networks: Cccn 2023

by Lei Meng
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Current price ₹14,690.00
Original price ₹22,599.00
Original price ₹22,599.00
Original price ₹22,599.00
(-35%)
₹14,690.00
Current price ₹14,690.00

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Book cover type: Paperback
  • ISBN13: 9783031471025
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 152
  • Original Price: EUR 199.99
  • Language: English
  • Edition: N/A
  • Item Weight: 226 grams
  • BISAC Subject(s): Telecommunications

Topics covered in this book contain cloud computing and semantic web technologies, cloud applications in vertical industries, cloud computing architecture and systems, cloud computing models, simulations and designs among others.

Lei Meng selected in the Qilu Young Scholar (Tier-1) program, has been Professor with the School of Software, Shandong University since 2020. He received the B.Eng.'s degree in Shandong University, China in 2010, and obtained the PhD's degree in Nanyang Technological University, Singapore in 2015, supervised by Prof. Ah-Hwee Tan. Taking the position of Research Fellow in 2015, he joined the Joint NTU-UBC Research Center of Excellence in Active Living for the Elderly (LILY), Nanyang Technological University, working with Prof. Chunyan Miao (Nanyang Technological University) and Prof. Cyril Leung (University of British Columbia). In 2018, he joined the NUS-Tsinghua-Southampton Centre for Extreme Search (NExT++), National University of Singapore, working as Senior Research Fellow with Prof. Tat-Seng Chua. He has been engaged in the research of machine learning theory and technology for big multimedia data analytics, with a focus on the directions of clustering, knowledge discoveryand data mining, and multimodal recognition and retrieval. His current research interests lie in the topics of adaptive resonance theory (ART), deep learning and their AI-powered applications in multimedia, data mining, and healthcare. He has published a book with Springer and more than twenty conference and journal papers at top and renowned venues, such as TKDE, TCYB, TMM, TNNLS, Neural Networks, MM, and AAAI. He has filed two international patents and taken in charge of a national program from the national natural science foundation of China. He is the editorial board member of Applied Soft Computing and have served as Program/Technical Committee member and Reviewer for a number of high-quality conferences and journals, such as MM, SIGIR, AAAI, IJCAI, KDD, ICDM, SDM, and TNNLS. He is a member of the International Neural Network Society (INNS), the Institute of Electrical and Electronics Engineers (IEEE), and the Association for the Advancement of Artificial Intelligence (AAAI).

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