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Multimaterial 3D Printing Technology

by Jiquan Yang
Save 40% Save 40%
Current price ₹11,256.00
Original price ₹18,760.00
Original price ₹18,760.00
Original price ₹18,760.00
(-40%)
₹11,256.00
Current price ₹11,256.00

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Book cover type: Paperback
  • ISBN13: 9780081029916
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Academic Press
  • Publisher Imprint: Academic Press
  • Publication Date:
  • Pages: 232
  • Original Price: USD 200.0
  • Language: English
  • Edition: N/A
  • Item Weight: 318 grams
  • BISAC Subject(s): Manufacturing and 3D Printing

Multi-material 3D Printing Technology introduces the first models for complex construction and manufacturing using a multi-material 3D printer. The book also explains the advantages that these innovative models provide at various points of the manufacturing supply chain. Innovations in fields such as medicine and aerospace are seeing 3D printing applied to problems that require the technology to develop beyond its traditional definitions. This groundbreaking book provides broad coverage of the theory behind this emerging technology, and the technical details required for readers to investigate these methods for themselves.

In addition to describing new models for application of this technology, this book also systematically summarizes the historical models, materials and relevant technologies that are important in multi-material 3D printing.

Na, Li: - Li Na is a Vice-Professor at Nanjing Normal University of China. She works at the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing of China. She has published 10 papers and 1 book, and holds 3 patents about 3D printing technology in China.

Shi, Jianping: - Jianping Shi is a Vice-Professor at Nanjing Normal University of China. He works at the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing of China. He has published 20 papers and 1 book, and holds 3 patents about 3D printing technology in China.

Tang, Wenlai: - Wenlai Tang is a Lecturer at Nanjing Normal University of China. He works at the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing of China. He has published 23 papers and 1 book, and holds 5 patents about 3D printing technology in China.

Yang, Jiquan: - Jiquan Yang is a Professor at Nanjing Normal University of China, Dean of the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing of China, Director of Nanjing 3D Printing Society of China, and Member of the Standardization Committee of China's additive manufacturing industry. He has published 60 papers and 9 books, and holds 40 patents all about 3D printing technology in China.

Zhang, Feng: - "Feng Zhang got his Ph.D. degree in Industrial Engineering from the State University of New York at Buffalo (UB), US, in September of 2018. From Nov. 2018 to Mar. 2019, he worked as a short term Postdoctoral researcher in the department of Mechanical and Aerospace Engineering with Dr. Deborah Chung. In May of 2019, he joined Nanjing Normal University, and is a member of Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing. He obtained his Bachelor degree from Wuhan University of technology in 2005. After several years' experience in industry, He attended UB and obtained his master degree in 2014. His current research interests include developing novel 3D printing methods for fabrication of various porous objects. Beginning February of 2019, Dr. Zhang's Ph.D. topic is supported by the National Science Foundation's most prestigious award - CAREER.
Dr. Zhang has served as the reviewer for many technique journals, including Rapid Prototyping, Additive Manufacturing, Journal of manufacturing process, Journal of manufacturing science and engineering. His work has been published in many high impact journal such as Nano Energy, Small, ACS Nano, and Nanotechnology."

Zhang, Gang: - Gang Zhang is a Vice-Professor at Nanjing Normal University of China. He works at the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing of China. He has published more than 30 SCI/SCIE papers and 1 book, and holds 2 patents about 3D self-packaging circuit technology in China.

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