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Packaging and Embedded Electronics for the Next Generation

by Nasa Technical Reports Server (Ntrs) , Michael J. Sampson
Save 8% Save 8%
Current price ₹1,337.00
Original price ₹1,446.00
Original price ₹1,446.00
Original price ₹1,446.00
(-8%)
₹1,337.00
Current price ₹1,337.00

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Book cover type: Paperback
  • ISBN13: 9781289250560
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Bibliogov
  • Publisher Imprint: Bibliogov
  • Publication Date:
  • Pages: 24
  • Original Price: USD 14.75
  • Language: English
  • Edition: N/A
  • Item Weight: 64 grams
  • BISAC Subject(s): General

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

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