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Power Integrity for Nanoscale Integrated Systems

by Masanori Hashimoto , Raj Nair
Save 17% Save 17%
Current price ₹17,008.00
Original price ₹20,410.00
Original price ₹20,410.00
Original price ₹20,410.00
(-17%)
₹17,008.00
Current price ₹17,008.00

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Book cover type: Hardcover
  • ISBN13: 9780071787765
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: McGraw-Hill Companies
  • Publisher Imprint: McGraw-Hill Companies
  • Publication Date:
  • Pages: 416
  • Original Price: USD 166.0
  • Language: English
  • Edition: N/A
  • Item Weight: 681 grams
  • BISAC Subject(s): Electronics / Circuits / General

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven methods for noise-tolerant nanoscale integrated circuit design

This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource.

Coverage includes:

  • Significance of power integrity for integrated circuits
  • Supply and substrate noise impact on circuits
  • Clock generation and distribution with power integrity
  • Signal and power integrity design for I/O circuits
  • Power integrity degradation and modeling
  • Lumped, distributed, and 3D modeling for power integrity
  • Chip temperature and PI impact
  • Low-power techniques and PI impact
  • Power integrity case study using the IBM POWER7+ processor chip
  • Carbon nanotube interconnects for power delivery

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