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Proceedings of the 4th International Conference on Electronics, Biomedical Engineering, and Health Informatics: Icebehi 2023, 4-5 October, Surabaya, Indonesia

by Triwiyanto Triwiyanto , Achmad Rizal , Wahyu Caesarendra
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Current price ₹16,893.00
Original price ₹25,989.00
Original price ₹25,989.00
Original price ₹25,989.00
(-35%)
₹16,893.00
Current price ₹16,893.00

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Book cover type: Paperback
  • ISBN13: 9789819714650
  • Binding: Paperback
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 715
  • Original Price: EUR 229.99
  • Language: English
  • Edition: N/A
  • Item Weight: 1193 grams
  • BISAC Subject(s): Electronics / General

This book presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI 2023, October 4-5, Surabaya, Indonesia). The contents are broadly divided into three main topics (a) Electronics, (b) Biomedical Engineering, and (c) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, development, applications, measurements, and testing. Featuring the latest advances in the field of biomedical engineering applications, this book serves as a definitive reference resource for researchers, professors, and practitioners interested in exploring advanced techniques in the field of electronics, biomedical engineering, and health informatics. The applications and solutions discussed here provide excellent reference material for future product development.

Dr. Triwiyanto received his Doctoral Degree in Electrical Engineering from Gadjah Mada University, Yogyakarta, Indonesia, in 2018. Since 2005, he has been Assistant Professor at the Electromedical Engineering Department, Health Polytechnic Ministry of Health Surabaya, Indonesia. Since 2015, he is IEEE Member and active to join in several international conferences and journals editor. His current research interests include biomedical signal processing, rehabilitation engineering, and surface electromyography (sEMG)-based physical human-robot interactions. Dr. Triwiyanto is previously Chairman and LNEE Book Chapter Editor for International Conference on Electronics, Biomedical Engineering, and Health Informatics 2020 (ICEBEHI 2020); ICEBEHI 2021, and ICEBEHI 2022. Currently, he has published more than 50 documents.
Dr. Achmad Rizal received Bachelor of Engineering in telecommunication engineering from STT Telkom (now, Telkom University), Bandung, Indonesia, in 2000. He received master's degree in biomedical engineering from Institut Teknologi Bandung, Bandung, Indonesia, in October 2006. He received Ph.D. degree from Universitas Gadjah Mada, Yogyakarta, Indonesia. His research interests include biomedical signal processing, biomedical image processing, biomedical instrumentation, and telemedicine. Now, he is Associate Professor at the School of Electrical Engineering, Telkom University.
Dr. Wahyu Caesarendra is Assistant Professor at the Faculty of Integrated Technologies, Universiti Brunei Darussalam, since October 2018. He received Doctor of Philosophy degree from the University of Wollongong in 2015. He worked as Postdoctoral Research Fellow in Rolls-Royce@NTU Corp Lab, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, from February 2017 to September 2018. In 2011, Wahyu Caesarendra was awarded University Postgraduate Award and International Postgraduate Tuition Awardfrom the University of Wollongong. He worked in an automotive and electrical company prior to joining Diponegoro University as Lecturer in 2007. He was Visiting Assistant Professor at the National Taiwan University of Science and Technology from August 5 to 11, 2019. He has authored more than 130 research articles in journals and conference proceedings. He is also Academic and Guest Editor in peer-reviewed journals. His research interest includes vibration condition monitoring, fault diagnosis and prognosis, mechatronics and robotics, machine learning and deep learning, mechanical design and 3D printing, smart manufacturing, and IoT.

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