From the Back Cover
This book includes selected conference proceedings of Conference on Processing and Characterization of Materials (CPCM-2020). The content of the book includes processing of and characterization of materials, sustainable energy materials, defense materials, functionally graded materials, and composites which has significant impact on cutting-edge applications. The book also includes surface engineering, computational methods and materials, waste utilization, and corrosion and environmental degradation of materials. Design, research, and development studies, experimental investigations, theoretical analysis, and fabrication techniques relevant to the application of materials in various assemblies, ranging from individual components to complete structure are presented in the book. The book is useful for graduate students, researchers, and industry professionals alike.
Dr. Snehanshu Pal is currently working as an assistant professor at the Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela. He has served as a postdoctoral fellow at the Department of Materials Science and Engineering, The Pennsylvania State University, USA. He has done Ph.D. in Metallurgical and Materials Engineering from the Indian Institute of Technology, Kharagpur, India. His research focuses on the study of deformation behavior of nanostructured material using MD simulation and modeling of metallurgical processes. He is leading the Computational Materials Engineering and Process Modeling Research Group at NIT, Rourkela, and a group dedicated to realizing the underlying physics behind the mechanical behavior of materials and simulating metallurgical processes. He has published 71 high-impact research articles in internationally reputed SCI indexed journals. He wrote two books, namely "Molecular Dynamics Simulation of NanostructuredMaterials: An Understanding of Mechanical Behavior" and "Process Modelling for Steel Industry." He has supervised three doctoral theses and several master theses. He is an investigator of numerous sponsored research projects and industrial projects. He has active research collaborations with esteemed universities across the globe (such as the University of Florida, the University of Manitoba, Université Lille, and the National Academy of Science of Belarus). In addition, He is associated with various esteemed technical and scientific societies such as Indian Institute of Metals and Indian Institute of Engineers. Dr. Debdas Roy is presently Associate Professor and Head at the Department of Materials and Metallurgical Engineering, National Institute of Foundry and Forge Technology, Hatia, Ranchi, Jharkhand, India. He obtained his Ph.D. (Metallurgical and Materials Engineering) from the Indian Institute of Technology, Kharagpur, India. His prime researchinterest comprises nanostructure material, nanomaterial, and biomaterial (synthesis, consolidation, and characterization). He has published 51 papers and a chapter in reputed international journal. He has also published a patent and awarded IEI Young Engineers Award in 2008in the field of Metallurgical and Materials Engineering, Young Metallurgist of the Year in 2010. Dr. Sudip Kumar Sinha is presently Assistant Professor at the Department of Metallurgical and Materials Engineering, National Institute of Technology Raipur, Chhattisgarh, India. He obtained his B.E. (Metallurgical and Materials Engineering) from Jadavpur University, Kolkata, M.Tech. (Materials Science and Engineering) from the Indian Institute of Technology, Kanpur, India, M.S. (Materials science and Engineering) from Washington State University, Pullman, USA, and Ph.D. (Metallurgical and Materials Engineering)from the Indian Institute of Technology, Kharagpur, India. His prime research interest comprises low-dimensional nanostructured materials, thin-film technology, chemical sensing of semiconductor metal oxides, and composite materials. He has published 29 papers and several chapters in reputed international journal and delivered several invited talks.
