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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

by E-H Wong , Y. -W Mai
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Current price ₹12,968.00
Original price ₹21,612.00
Original price ₹21,612.00
Original price ₹21,612.00
(-40%)
₹12,968.00
Current price ₹12,968.00

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Book cover type: Hardcover
  • ISBN13: 9781845695286
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Woodhead Publishing
  • Publisher Imprint: Woodhead Publishing
  • Publication Date:
  • Pages: 482
  • Original Price: USD 225.0
  • Language: English
  • Edition: N/A
  • Item Weight: 899 grams
  • BISAC Subject(s): Electronics / Microelectronics

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Mai, Y. -W: - Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

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