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System on Package: Miniaturization of the Entire System

by Rao Tummala
Save 17% Save 17%
Current price ₹16,039.00
Original price ₹19,247.00
Original price ₹19,247.00
Original price ₹19,247.00
(-17%)
₹16,039.00
Current price ₹16,039.00

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Book cover type: Hardcover
  • ISBN13: 9780071459068
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: McGraw-Hill Companies
  • Publisher Imprint: McGraw-Hill Companies
  • Publication Date:
  • Pages: 785
  • Original Price: USD 154.0
  • Language: English
  • Edition: 1
  • Item Weight: 1398 grams
  • BISAC Subject(s): Electrical

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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