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Through-Silicon Vias for 3D Integration

by John H. Lau
Save 17% Save 17%
Current price ₹18,322.00
Original price ₹21,987.00
Original price ₹21,987.00
Original price ₹21,987.00
(-17%)
₹18,322.00
Current price ₹18,322.00

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Book cover type: Hardcover
  • ISBN13: 9780071785143
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: McGraw-Hill Companies
  • Publisher Imprint: McGraw-Hill Companies
  • Publication Date:
  • Pages: 512
  • Original Price: USD 179.0
  • Language: English
  • Edition: N/A
  • Item Weight: 681 grams
  • BISAC Subject(s): Electrical

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A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

  • Nanotechnology and 3D integration for the semiconductor industry
  • TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
  • TSVs: mechanical, thermal, and electrical behaviors
  • Thin-wafer strength measurement
  • Wafer thinning and thin-wafer handling
  • Microbumping, assembly, and reliability
  • Microbump electromigration
  • Transient liquid-phase bonding: C2C, C2W, and W2W
  • 2.5D IC integration with interposers
  • 3D IC integration with interposers
  • Thermal management of 3D IC integration
  • 3D IC packaging

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