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Transactions on Engineering Technologies: World Congress on Engineering 2014

by Gi-Chul Yang
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Current price ₹14,553.00
Original price ₹22,389.00
Original price ₹22,389.00
Original price ₹22,389.00
(-35%)
₹14,553.00
Current price ₹14,553.00

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Book cover type: Hardcover
  • ISBN13: 9789401798037
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Publication Date:
  • Pages: 773
  • Original Price: EUR 199.99
  • Language: English
  • Edition: 2015
  • Item Weight: 1271 grams
  • BISAC Subject(s): Electronics / General, Applied, and Artificial Intelligence / General

From the Back Cover

This volume contains fifty-one revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, UK, 2-4 July, 2014), under the World Congress on Engineering 2014 (WCE 2014). Topics covered include mechanical engineering, bioengineering, internet engineering, wireless networks, image engineering, manufacturing engineering, and industrial applications. The book offers an overview of the tremendous advances made recently in engineering technologies and the physical sciences and their applications, and also serves as an excellent reference for researchers and graduate students working in these fields.

Professor Gi-Chul Yang is a professor in the Department of Multimedia Engineering, College of Engineering, Mokpo National University, South Korea and has been the director of School of Information Engineering of the university.

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is a former visiting professor of Cranfield University, UK and University of Wyoming, USA.

Professor Len Gelman is the Chair in Vibro-Acoustic Monitoring and Director of Centre of Vibro-Acoustics and Fatigue, Cranfield University and is a Fellow of the British Institute of Non-Destructive Testing (BINDT) and UK Institution of Diagnostic Engineers, Chairman of the Condition Monitoring and Diagnostic Technology Committee of the BINDT and Director of the International Institute of Acoustics and Vibration (USA).

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