Skip to content

Booksellers & Trade Customers: Sign up for online bulk buying at trade.atlanticbooks.com for wholesale discounts

Booksellers: Create Account on our B2B Portal for wholesale discounts

ULSI Semiconductor Technology Atlas

by Chih-Hang Tung
Save 12% Save 12%
Current price ₹22,737.00
Original price ₹25,800.00
Original price ₹25,800.00
Original price ₹25,800.00
(-12%)
₹22,737.00
Current price ₹22,737.00

Imported Edition - Ships in 18-21 Days

Free Shipping in India on orders above Rs. 500

Request Bulk Quantity Quote
+91
Book cover type: Hardcover
  • ISBN13: 9780471457725
  • Binding: Hardcover
  • Subject: N/A
  • Publisher: Wiley-Interscience
  • Publisher Imprint: Wiley-Interscience
  • Publication Date:
  • Pages: 666
  • Original Price: GBP 203.95
  • Language: English
  • Edition: N/A
  • Item Weight: 1384 grams
  • BISAC Subject(s): Logic Design and Electronics / Semiconductors

More than 1,100 TEM images illustrate the science of ULSI

The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems.

The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts:
* Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation
* Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization
* Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development
* Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics


This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with:
* More than 1,100 TEM images to illustrate the science of ULSI
* A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues
* Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs

CHIH-HANG TUNG is a senior member of the technical staff and Project Leader at the Institute of Microelectronics in Singapore.

GEORGE T. T. SHENG was the first to develop cross-sectioning samples of TEM studies of semiconductor devices and has been involved with many other groundbreaking projects at Bell Labs.

CHIH-YUAN LU is Chairman and CEO of Ardentec Corp., an ULSI testing service company. He is also CTO of Macronix International Co., Ltd., the eighth largest worldwide NVM semiconductor company.

Trusted for over 49 years

Family Owned Company

Secure Payment

All Major Credit Cards/Debit Cards/UPI & More Accepted

New & Authentic Products

India's Largest Distributor

Need Support?

Whatsapp Us